A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.
Stamping is one of our most proud of technology
It's a high-speed process that is typically accomplished by a series of stamping operations that progressively approach the final lead frame geometry, the number of steps being entirely depend on the complexity of the lead frame.
1. More than 20 years of experiences indeveloping and designing the ultra-precise terminal’s stamping. Design andmanufacture the tooling of ultra-precise rapid stamping.
1.1The minimum pitch is 0.3mm.
1.2The minimum thickness of material is 0.05mm.
2. Stamping for electronic high precisionterminals.
3.Customized design and manufacturingcapability (ODM, OEM Co-operation).
4. Forging & stamping for special-shapeparts of variable thickness.
6. Application in Power Semiconductor.
Sunlit precision technology with near 4 decades of high precision stamping parts, both on R&D and manufacturing experience.
Dedicated to industrial connectors has been 2 decades, with stable and reliable quality, comparable to Molex, TE, and Japanese manufacturers.
Contact us to learn more about our products or to get a custom quote.
sales@sunlit-tech.com.tw
